Systems, methods, and apparatuses for implementing reduced height semiconductor packages for mobile electronics

ABSTRACT

In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing reduced height semiconductor packages for mobile electronics. For instance, there is disclosed in accordance with one embodiment a stacked die package having therein a bottom functional silicon die; a recess formed within the bottom functional silicon die by a thinning etch partially reducing a vertical height of the bottom functional silicon die at the recess; and a top component positioned at least partially within the recess formed within the bottom functional silicon die. Other related embodiments are disclosed.

COPYRIGHT NOTICE

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TECHNICAL FIELD

The subject matter described herein relates generally to the field ofsemiconductor and electronics manufacturing, and more particularly, tosystems, methods, and apparatuses for implementing reduced heightsemiconductor packages for mobile electronics.

BACKGROUND

The subject matter discussed in the background section should not beassumed to be prior art merely as a result of its mention in thebackground section. Similarly, a problem mentioned in the backgroundsection or associated with the subject matter of the background sectionshould not be assumed to have been previously recognized in the priorart. The subject matter in the background section merely representsdifferent approaches, which in and of themselves may also correspond toembodiments of the claimed subject matter.

In semiconductor manufacturing there is a constant drive to decrease thesize of the manufactured semiconductor devices and semiconductorpackages which ultimately are placed into consumer electronics such assmart phones, tablets, wearables, and so forth.

Package height of a semiconductor device is a critical driver for mobileapplication applications, especially with respect to portable consumerelectronics such as smart phones, smart watches, wearables, and soforth. Reduction of semiconductor height translates directly to theability to produce and manufacture thinner devices, such as thinnersmart phones.

Characteristics such as how thin a mobile device or smart phone iscompared to other competing products in the marketplace is very often akey consideration for consumers looking to purchase such devices.

The present state of the art may therefore benefit from the means forimplementing reduced height semiconductor packages for mobileelectronics as described herein.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments are illustrated by way of example, and not by way oflimitation, and will be more fully understood with reference to thefollowing detailed description when considered in connection with thefigures in which:

FIG. 1 depicts an exemplary planar hybrid stack for a semiconductorpackage in accordance with which embodiments may operate;

FIG. 2A depicts an alternative exemplary semiconductor package having areduced height in accordance with described embodiments;

FIG. 2B depicts another alternative exemplary semiconductor packagehaving a reduced height in accordance with described embodiments;

FIG. 2C depicts additional alternative exemplary semiconductor packages,each having a reduced height, in accordance with described embodiments;

FIG. 3 depicts another alternative exemplary semiconductor packagehaving a reduced height in accordance with described embodiments;

FIG. 4A depicts alternative exemplary semiconductor packages, eachhaving a reduced height in accordance with described embodiments;

FIG. 4B depicts additional alternative exemplary semiconductor packages,each having a reduced height in accordance with described embodiments;

FIG. 5A depicts a process flow for the non-planar stacking of a top chipto a bottom chip with connectivity to a substrate;

FIG. 5B depicts a continuation process flow for the non-planar stackingof a top chip to a bottom chip with connectivity to a substrate;

FIG. 5C depicts a continuation process flow for alternative processing(a) at element from FIG. 5B;

FIG. 5D depicts a continuation process flow for alternative processing(b) at element from FIG. 5B;

FIG. 5E depicts a continuation process flow for alternative processing(c) at element from FIG. 5B;

FIG. 6A depicts an alternative process flow for the non-planar stackingof an overlapping top chip onto a bottom chip;

FIG. 6B depicts a continuation process flow for a non-planar andoverlapping top chip;

FIG. 7 is a schematic of a computer system in accordance with describedembodiments;

FIG. 8 illustrates an interposer that includes one or more describedembodiments;

FIG. 9 illustrates a computing device in accordance with oneimplementation of the invention; and

FIG. 10 is a flow diagram illustrating a method for implementing reducedheight semiconductor packages for mobile electronics in accordance withdescribed embodiments.

DETAILED DESCRIPTION

Described herein are systems, methods, and apparatuses for implementingreduced height semiconductor packages for mobile electronics. Forinstance, there is disclosed in accordance with one embodiment a stackeddie package having therein a bottom functional silicon die; a recessformed within the bottom functional silicon die by a thinning etchpartially reducing a vertical height of the bottom functional silicondie at the recess; and a top component positioned at least partiallywithin the recess formed within the bottom functional silicon die.

In the following description, numerous specific details are set forthsuch as examples of specific systems, languages, components, etc., inorder to provide a thorough understanding of the various embodiments. Itwill be apparent, however, to one skilled in the art that these specificdetails need not be employed to practice the embodiments disclosedherein. In other instances, well known materials or methods have notbeen described in detail in order to avoid unnecessarily obscuring thedisclosed embodiments.

In addition to various hardware components depicted in the figures anddescribed herein, embodiments further include various operations whichare described below. The operations described in accordance with suchembodiments may be performed by hardware components or may be embodiedin machine-executable instructions, which may be used to cause ageneral-purpose or special-purpose processor programmed with theinstructions to perform the operations. Alternatively, the operationsmay be performed by a combination of hardware and software.

Any of the disclosed embodiments may be used alone or together with oneanother in any combination. Although various embodiments may have beenpartially motivated by deficiencies with conventional techniques andapproaches, some of which are described or alluded to within thespecification, the embodiments need not necessarily address or solve anyof these deficiencies, but rather, may address only some of thedeficiencies, address none of the deficiencies, or be directed towarddifferent deficiencies and problems which are not directly discussed.

Implementations of embodiments of the invention may be formed or carriedout on a substrate, such as a semiconductor substrate. In oneimplementation, the semiconductor substrate may be a crystallinesubstrate formed using a bulk silicon or a silicon-on-insulatorsubstructure. In other implementations, the semiconductor substrate maybe formed using alternate materials, which may or may not be combinedwith silicon, that include but are not limited to germanium, indiumantimonide, lead telluride, indium arsenide, indium phosphide, galliumarsenide, indium gallium arsenide, gallium antimonide, or othercombinations of group III-V or group IV materials. Although a fewexamples of materials from which the substrate may be formed aredescribed here, any material that may serve as a foundation upon which asemiconductor device may be built falls within the spirit and scope ofthe present invention.

A plurality of transistors, such as metal-oxide-semiconductorfield-effect transistors (MOSFET or simply MOS transistors), may befabricated on the substrate. In various implementations of theinvention, the MOS transistors may be planar transistors, nonplanartransistors, or a combination of both. Nonplanar transistors includeFinFET transistors such as double-gate transistors and tri-gatetransistors, and wrap-around or all-around gate transistors such asnanoribbon and nanowire transistors. Although the implementationsdescribed herein may illustrate only planar transistors, it should benoted that the invention may also be carried out using nonplanartransistors.

Each MOS transistor includes a gate stack formed of at least two layers,a gate dielectric layer and a gate electrode layer. The gate dielectriclayer may include one layer or a stack of layers. The one or more layersmay include silicon oxide, silicon dioxide (SiO₂) and/or a high-kdielectric material. The high-k dielectric material may include elementssuch as hafnium, silicon, oxygen, titanium, tantalum, lanthanum,aluminum, zirconium, barium, strontium, yttrium, lead, scandium,niobium, and zinc. Examples of high-k materials that may be used in thegate dielectric layer include, but are not limited to, hafnium oxide,hafnium silicon oxide, lanthanum oxide, lanthanum aluminum oxide,zirconium oxide, zirconium silicon oxide, tantalum oxide, titaniumoxide, barium strontium titanium oxide, barium titanium oxide, strontiumtitanium oxide, yttrium oxide, aluminum oxide, lead scandium tantalumoxide, and lead zinc niobate. In some embodiments, an annealing processmay be carried out on the gate dielectric layer to improve its qualitywhen a high-k material is used.

The gate electrode layer is formed on the gate dielectric layer and mayconsist of at least one P-type workfunction metal or N-type workfunctionmetal, depending on whether the transistor is to be a PMOS or an NMOStransistor. In some implementations, the gate electrode layer mayconsist of a stack of two or more metal layers, where one or more metallayers are workfunction metal layers and at least one metal layer is afill metal layer.

For a PMOS transistor, metals that may be used for the gate electrodeinclude, but are not limited to, ruthenium, palladium, platinum, cobalt,nickel, and conductive metal oxides, e.g., ruthenium oxide. A P-typemetal layer will enable the formation of a PMOS gate electrode with aworkfunction that is between about 4.9 eV and about 5.2 eV. However,with every shrink of line width in the Front End (FE) such operationvoltages are reduced. For an NMOS transistor, metals that may be usedfor the gate electrode include, but are not limited to, hafnium,zirconium, titanium, tantalum, aluminum, alloys of these metals, andcarbides of these metals such as hafnium carbide, zirconium carbide,titanium carbide, tantalum carbide, and aluminum carbide. An N-typemetal layer will enable the formation of an NMOS gate electrode with aworkfunction that is between about 3.9 eV and about 4.2 eV or lower fordevices having smaller line widths.

In some implementations, the gate electrode may consist of a “U”-shapedstructure that includes a bottom portion substantially parallel to thesurface of the substrate and two sidewall portions that aresubstantially perpendicular to the top surface of the substrate. Inanother implementation, at least one of the metal layers that form thegate electrode may simply be a planar layer that is substantiallyparallel to the top surface of the substrate and does not includesidewall portions substantially perpendicular to the top surface of thesubstrate. In further implementations of the invention, the gateelectrode may consist of a combination of U-shaped structures andplanar, non-U-shaped structures. For example, the gate electrode mayconsist of one or more U-shaped metal layers formed atop one or moreplanar, non-U-shaped layers.

In some implementations of the invention, a pair of sidewall spacers maybe formed on opposing sides of the gate stack that bracket the gatestack. The sidewall spacers may be formed from a material such assilicon nitride, silicon oxide, silicon carbide, silicon nitride dopedwith carbon, and silicon oxynitride. Processes for forming sidewallspacers are well known in the art and generally include deposition andetching process steps. In an alternate implementation, a plurality ofspacer pairs may be used, for instance, two pairs, three pairs, or fourpairs of sidewall spacers may be formed on opposing sides of the gatestack.

As is well known in the art, source and drain regions are formed withinthe substrate adjacent to the gate stack of each MOS transistor. Thesource and drain regions are generally formed using either animplantation/diffusion process or an etching/deposition process. In theformer process, dopants such as boron, aluminum, antimony, phosphorous,or arsenic may be ion-implanted into the substrate to form the sourceand drain regions. An annealing process that activates the dopants andcauses them to diffuse further into the substrate typically follows theion implantation process. In the latter process, the substrate may firstbe etched to form recesses at the locations of the source and drainregions. An epitaxial deposition process may then be carried out to fillthe recesses with material that is used to fabricate the source anddrain regions. In some implementations, the source and drain regions maybe fabricated using a silicon alloy such as silicon germanium or siliconcarbide. In some implementations the epitaxially deposited silicon alloymay be doped in situ with dopants such as boron, arsenic, orphosphorous. In further embodiments, the source and drain regions may beformed using one or more alternate semiconductor materials such asgermanium or a group III-V material or alloy. And in furtherembodiments, one or more layers of metal and/or metal alloys may be usedto form the source and drain regions.

One or more interlayer dielectrics (ILD) are deposited over the MOStransistors. The ILD layers may be formed using dielectric materialsknown for their applicability in integrated circuit structures, such aslow-k dielectric materials. Examples of dielectric materials that may beused include, but are not limited to, silicon dioxide (Sift), carbondoped oxide (CDO), silicon nitride, organic polymers such asperfluorocyclobutane or polytetrafluoroethylene, fluorosilicate glass(FSG), and organosilicates such as silsesquioxane, siloxane, ororganosilicate glass. The ILD layers may include pores or air gaps tofurther reduce their dielectric constant.

FIG. 1 depicts an exemplary planar hybrid stack for a semiconductorpackage 101 in accordance with which embodiments may operate.

In particular, there is depicted various elements making up thesemiconductor package 101 including the PCB board 105, solder balls 110electrically interfacing the PCB board 105 with the substrate 135 of thesemiconductor package, micro-bumps 115 electrically interfacing thebottom chip 125 to the substrate 135, a top chip 130 (e.g., a topfunctional silicon die) placed atop the bottom chip 125 (e.g. a bottomfunctional silicon die), in which the top chip 130 is electricallyinterfaced to the substrate 135 via wire bonds 120.

Moreover, as is depicted via the axises 190 in the z, y, and xdimensions, the depicted semiconductor package 101 exhibits a reducedheight 191 due to the stacking of the top chip upon the bottom chipwithin the semiconductor package 101 formed from both the top functionalsilicon die and the bottom functional silicon die (e.g., the top chipand the bottom chip).

FIG. 2A depicts an alternative exemplary semiconductor package 201having a reduced height in accordance with described embodiments.

In particular, it can be seen within the semiconductor package 201 thefurther reduction in height 291 due to the top (inset) chip 230 beingrecessed within a cutaway portion of the bottom (etched) chip 225,causing a portion of the vertical height of the top chip 230 to berecessed within a portion of the vertical height of the bottom chip 225.Axises 290 are depicted in the bottom left showing the reduction inheight 291 of the semiconductor package 201. As depicted here, the topchip 230 is recessed within a laterally right recess (on the x axis) ofthe bottom chip 225.

As before, the bottom chip is electrically interfaced to the substrate235 via micro-bumps and the top chip 230 is electrically interfaced withthe substrate 235 via wire bonds. The substrate 235 in turn iselectrically interfaced with the PCB board 205 via the solder balls 210.

Providing a reduced height 291 (in the Z or vertical axis) directlytranslates to the ability to build thinner consumer products such asthinner smart phones, tablets, watches, and other wearables.

To achieve such a result there are varying solutions such as thin PoP,or stacked chip solutions. Thin PoP or “Package on package” technologyis an integrated circuit packaging method to combine vertically discretelogic and memory ball grid array (BGA) packages. Two or more packagesare installed atop each other, that is to say, they are stacked, withelectrical conductivity or electrical interfaces to route signalsbetween them. Such technologies allow for higher component density indevices, such as mobile phones, personal digital assistants (PDA), anddigital cameras, etc.

For PoP and stacked chip solutions, including the hybrid stacks asdepicted here, the achievable minimum height (e.g., on the Z or verticalaxis as depicted) depends upon equipment and process tolerances foroperations such as grinding, handling, board assembly, etc., whichultimately lead to a variety of minimum height limitations. According tocertain embodiments, a hybrid stack is built by putting two discretesemiconductor dies (e.g., logic dies, memory dies, etc.) backside tobackside and electrically interfacing the contact pads of thesemiconductors to one side using BGA, wire bond, or TSV technologies, ora combination of electrical interfacing means.

According to described embodiments, so as to attain a further reducedheight 291, of a hybrid semiconductor package stack a wet etching or dryetching process is performed to form a recess locally into the bottomchip 225 backside, into which the top chip 230 is then placed.

By placing the top chip 230 into a wet or dry etched recess formed intothe bottom chip 225 a further reduction in height 291 may then berealized for the stacked die semiconductor package while maintainingstability for the stacked die semiconductor package.

As can be seen, the bottom die or bottom chip 225 of a hybrid stackedsemiconductor package with an open backside is etched to form a localopening or a local recess to receive the top die or top chip 230.

So as to accomplish the etch, a resist is added with a local openingwhere the recess is to be formed and then after exposure the localrecess is wet or dry etched into the backside of the bottom chip 225.

After removal of the resist, the top die or top chip 230 may thus beplaced into the recess formed in the backside of the bottom chip 230.

According to certain embodiments, the etch is performed at the singledie level or may alternatively be performed at the wafer level formultiple dies or multiple bottom chips simultaneously prior to chipsingulation (e.g., prior to separation of the discrete chips from thewafer).

Unlike prior solutions which sought reduced height (in the Z or verticalaxis) by thinning the entity of the backside of the bottom chip 225, thelocalized etch does not introduce handling issues and therefore theprocess may be utilized with current chip handling procedures withoutretooling. Additionally, mass-reflow may be utilized. Mass-reflowsoldering is the process by which a solder paste is used to temporarilyattach several electrical components to their contact pads, after whichthe entire assembly is subjected to controlled heat, which melts thesolder, permanently connecting the joint, for instance, by passing thesemiconductor package assembly through a reflow oven.

Etching processing may vary per design considerations. For instance,according to described embodiments, a wet chemistry etch or an ionetching process for etching the localized recess may be implemented toavoids sharp edges, which make the silicon die susceptible to fracture.

According to certain embodiments, wet chemistry etch using a resist ispreferable as it represents an established process in the frontend andfurther because the wet etch process can also be reused in the packagebackend processing. Ion etching with a resist may be preferred in otherembodiments where the ion etch is the established process for a givenproduct's manufacture. Described embodiments are not limited to eithertechnology.

FIG. 2B depicts another alternative exemplary semiconductor package 202having a reduced height in accordance with described embodiments.

As can be seen here, the top (inset) chip 230 is now recessed within acenter portion of the bottom (etched) chip 225 providing for a reductionin height 291. As before, there is electrical connectivity from the topchip 230 to the substrate 235 via the wire bonds 220 and there iselectrical connectivity from the bottom chip 225 to the substrate 235via the micro-bumps 215, with the substrate 235 being electricallyinterfaced with the PCB board 205 via the solder balls 210.

FIG. 2C depicts additional alternative exemplary semiconductor packages203, each having a reduced height, in accordance with describedembodiments. As can be seen here, a reduction in height 291 isattainable by recessing the top chip 230 into a recessed portion of thebottom chip 225, while maintaining electrical connectivity necessary forfunctioning of the functional semiconductor devices (e.g., the top insetchip and the bottom etched chip) to the substrate via the wire bonds andthe micro-bumps respectively. The recess of the bottom chip may bepresent at a lateral left side (on the x axis) on the lateral rightside, in the center, aligned to the lateral left, aligned to the lateralright, or offset to create an overhang from the lateral left or right orinset to create a setback from the lateral left or right.

Placement of the top chip within the recess of the bottom chip may bevaried according to design considerations.

Reducing the thickness of functional silicon dies (e.g., chips orsemiconductor chips or semiconductor dies) through a process such asgrinding will result in a thinner semiconductor package when the chipsare ultimately stacked, however, grinding or thinning greatly increasesthe risk of fracture since the thinned dies are more brittle andtherefore more susceptible to breaking.

By reducing the thickness of the dies at a localized area to create arecess as is shown here, the total height of the semiconductor packagemay be reduced by placing another smaller functional silicon die withinthe recess formed within a larger functional silicon die.

FIG. 3 depicts another alternative exemplary semiconductor package 301having a reduced height in accordance with described embodiments.

As can be seen here, the bottom chip 325 is no longer etched and thus nolonger possesses a recess for the top chip 330. Rather, the top chip 330has been elongated to fully encompass the width of the bottom chip 325and overhang the bottom chip 325. As depicted, the bottom chip 325 isnot etched and has no recess, but the top chip now is now etched andthus exhibits a recess within which the bottom chip may be placed or asthe inset chip. Alternatively, the top chip 330 having been etched toform the recess may be placed over the bottom chip 325, thus enablingthe reduction in height 391 as the height of the bottom chip 325 isinset and now resides within a portion of the height of the top chip aspermitted by the recess made within the top chip 330. Axises 390 aredepicted in the bottom left showing the reduction in height 391 of thesemiconductor package 301.

As before, there is electrical connectivity from the top chip 330 to thesubstrate 335 via wire bonds 320 and there is electrical connectivityfrom the bottom chip 325 to the substrate 335 via the micro-bumps 315.The substrate in turn is electrically interfaced with the solder balls310 which may then be connected with another device, such as a PCBmotherboard, main board, circuit board, etc., so as to provide acompleted electrical and therefore functional communications path fromeach of the top chip 330 and the bottom chip 325 despite thesemiconductor package 301 having a total reduced height 391 (in the Z orvertical axis).

FIG. 4A depicts alternative exemplary semiconductor packages 401, eachhaving a reduced height in accordance with described embodiments.

As can be seen here, there are varying methodologies by which theelectrical connectivity between a top chip 430 and the bottom chip 425is attainable.

On the top left at semiconductor package 481, the top chip is recessedwithin a lateral right (on the x axis) portion of the bottom chip 425.However, there are no longer wire bonds connecting the top chip 430 tothe substrate 435. Rather, TSVs 440 are utilized to provide electricalconnectivity from the top chip 430 through the bottom chip 425 and tomicro-bumps 415 which are electrically interfaced to the substrate 435.The bottom chip 425 is likewise electrically interfaced to the substrate435 by way of the micro-bumps 415. As depicted here, all the TSVs 440are positioned on the lateral left side of the bottom chip to make roomfor the recess within the bottom chip 425 to accept the top chip 430.

In semiconductor manufacturing, such as the manufacture of semiconductorpackages and semiconductor devices, there exists a need to createthrough-silicon vias (TSVs) through the substrate or through othermaterials such as through the bottom chip 425 as depicted here. Socalled “vias” are typically vertical electrical connections, hence theterm “via” which pass completely through a silicon wafer or die such asthe bottom chip 425. Use of such vias may be called upon as either analternative to wire-bond and flip chip technologies or even supplementsuch technologies in the manufacturing of semiconductor devicesincluding three-dimensional (3D) semiconductor packages, 3D integratedcircuits, System on Chip (SoC) semiconductor devices, and relatedsemiconductor components. Use of vias provides for a greater circuitdensity and additionally permits connections which are shorter inlength.

Moving to the semiconductor package 482 depicted at the top right it canbe seen that the top chip 430 resides within a laterally centered (onthe x axis) recessed portion of the bottom chip 425. Here the electricalconnectivity from the top chip 430 to the substrate is againaccomplished through a continuous metallic electrical path from contactpads at the top chip 430 to the TSVs 440 down through the bottom chip425 and to the substrate 435 through the micro-bumps 415. However, ascan be seen, there are TSVs 440 located both laterally left andlaterally right (on the horizontal planar axis) from the top chip 430.Stated differently the recess of the bottom chip which accepts the topchip is in-between TSVs 440 through the bottom chip 425. As before, thesolder balls 410 provide electrical connectivity from the substrate 435which is connected with each of the top and bottom chips to anotherdevice, board, component, or interface, such as a main board or a motherboard, etc.

Notably, the top chip 430 is partially but not fully recessed within thevertical height of the bottom chip 425. Consequently, there is areduction in height but the top chip 430 does partially protrude fromthe top surface of the bottom chip 425.

Moving now to the bottom left it may be observed that semiconductorpackage 483 has a top chip 430 which is fully recessed within thevertical height of the bottom chip, such that a top surface of the topchip is flush with the top surface of the bottom chip as the top chip isfully encompassed within the recess formed within the bottom chip 425.In such a way, still greater reduction in vertical height is attainable.

As before, TSVs 440 provide electrical connectivity from the top chip430 to the substrate 435 through the bottom chip to the micro-bumps 415and to the substrate 435.

FIG. 4B depicts additional alternative exemplary semiconductor packages402, each having a reduced height in accordance with describedembodiments.

As can be seen here on the top left at semiconductor package 486, thereis the top chip 430 which is partially recessed within the height of thebottom chip 425 at the lateral right (on the horizontal axis) side ofthe bottom chip 425. As depicted, electrical connectivity achieved fromcontacts of the top chip 430 to the TSVs 440 by way of wire bonds 420.However, other means are equally permissible.

Moving to the top right there is depicted the semiconductor package 487in which the top chip 430 is partially recessed within the height of thebottom chip 425 and is positioned in a centered portion of the bottomchip 425. Wire bonds 420 provide electrical connectivity from thecontacts of the top chip 430 to the substrate 435 through the TSVs 440provided through the bottom chip at the lateral left and right sidesfrom the recess of the bottom chip 425.

Moving to the bottom left at semiconductor package 488 it may now beobserved that there is a top chip 430 having been fully set into andtherefore fully encompassed within the height of the bottom chip 425.Specifically, the full height of the top chip 430 resides within theheight of the bottom chip 425 with no protrusion of the top chip 430from the top of the bottom chip 425. Due to the tolerances of the recessetch and the top die there may also exist a gap to be filled up beforebuildup of the RDL. Such a gap may be filled during the die attachedglue operation.

Rather than wire bonds being utilized for electrical connectivity fromthe contacts of the top chip to the TSVs 440 through the bottom chip425, RDL connectivity is instead provided, with the RDL contactsproviding a complete electrical path from the contacts of the top chipthrough the RDL 475 interface to the TSVs 440 which then electricallyinterface the top chip 430 to the substrate via the TSVs 440 to themicro-bumps 415 and ultimately into the substrate 435.

The Re-Distribution Layer (RDL) is an additional metal layer on a chipthat re-routes or re-distributes the IO contact pads of an integratedcircuit such as the top chip 430 such that connectivity to those contactpads are available in other locations, such as routing orre-distributing the contact pads on the top chip 430 to the TSVs 440 asdepicted.

RDL or so-called “Re-Distribution Layer” technology is utilized insemiconductor package designs to redistribute I/O (input/output) pads tobump pads without changing the I/O pad placement. Flip-chip assembly maylikewise be utilized with or in place of wire bond connections 420because it reduces chip area while supporting many more I/Os while alsoreducing inductance, allowing for high-speed signals, and providingbetter heat conductivity properties. A Flip-Chip Ball Grid Array (FCBGA)or Copper pillars are often utilized in conjunction therewith for highI/O count chips. For instance, the micro-bumps 415 may form a FCBGA or aBall Grid Array (BGA) for the substrate 435.

Moving now to the bottom right, it may be observed that thesemiconductor package 489 also has an RDL 475 layer providingconnectivity from the top chip 430 to the TSVs 440 traversing throughthe bottom chip 425, however, the top chip 430 is not fully recessedwithin the height of the bottom chip 425, but rather, is partiallyrecessed and partially protrudes from the top surface of the bottom chip425. However, the RDL 475 redistribution layer may nevertheless beutilized to provide connectivity from the IO pads of the top chip to theTSVs 440 through the bottom chip to the micro-bumps 415 and into thesubstrate 435 in the manner depicted.

According to certain embodiments, eWLB or “embedded Wafer Level BGA” andvia Bars are instead utilized for electrical connectivity from thecontacts of the top chip to the TSVs or substrate. For instance, eWLBflow with a two sided redistribution (RDL) layer provides for multiplepossibilities for electrical connection from the top chip with varyingheight. Moreover, technologies such as TMV, TSV, pre-fabricated via bars(PCB, Si), area array interconnects on the semiconductor packagebackside likewise may be utilized to provide for a reduced packageheight.

In an alternative embodiment, the top chip which is inset into thebottom etched chip may be replaced with a copper heat sink or a heatspreader to improve the thermal dissipation characteristics of thesemiconductor package.

FIG. 5A depicts a process flow 501 for the non-planar stacking of a topchip to a bottom chip 525 with connectivity to a substrate 535. As canbe seen, there is a bottom chip 525 having a photo resist layer 545thereupon, the bottom chip electrically interfaced to a substrate 535via the micro-bumps 515 and the substrate 535 capable of being furtherelectrically interfaced to other components via the solder balls 510.

As depicted at operation 581, the bottom chip 525 is exposed to a photoresist layer 545 and then through a wet etch process 582, a recess 550is formed into a top surface of the bottom chip 525, the formed recess550 being capable of receiving a top chip at least partially within thevertical height of the bottom chip 525. Such a recess 550 may also bepresent under photoresist layer 545 due to the isotropic etch rate of awet chemistry process. Conversely, if Reactive Ion Etching (RIE) isutilized then a 1:1 edge correspondence with the photoresist will remainas depicted. However, if wet etching chemistry is utilized then a slightundercut of the silicon under the photoresist will result as is depictedat recess 550 having a slight undercut from the photo resist layer 545above. According to alternative embodiments, etching may be performed atthe wafer level, prior to singulation of the functional silicon diesforming bottom chip 525 from the wafer and without the bottom die beingattached to any substrate. According to other embodiments the etch isperformed at a per-chip level, meaning the bottom chip formed from thefunctional silicon dies of a wafer has been singulated from the waferand affixed to a substrate.

Thinning or etching can be done at the wafer level prior to singulationsuch that a larger photo resist may be utilized to create the localizedrecesses within many functional silicon dies simultaneously to easehandling and processing burdens. At the time of chip singulation, theresulting separated chips, each separated into discrete functionalsilicon dies, will therefore already have the localized recess 550within which they may then receive another smaller or appropriatelysized second chip, such as the top chip as is depicted here.

The etching process may be calibrated so as to form the recess withinthe bottom chips at varying locations and depths, regardless of whetherat the wafer level in bulk or individually at the chip level. Forinstance, as is depicted here and in the figures that follow, the recessmay be to the right, left, center, front, back, or anywhere upon thebottom chip which permits a recess to be formed into the bottom chipwithout affecting functionality of the bottom chip and while maintainingsufficient structural rigidity of the bottom chip.

Varying depths may be accommodated depending on the implementation, someof which permit the top chip to partially recess within the bottom chipand others which permit the top chip to fully recess within the bottomchip, resulting in a planar top surface in which the top non-etched andnon-recessed surface of the bottom chip and the top surface of the topchip align when the top chip is placed within the recess of the bottomchip.

According to certain embodiments, a trough is formed into the bottomchip through a photoresist exposure and etch process, in which the opentrough is then utilized as the recess of the bottom chip within whichthe top chip may be placed.

According to particular embodiments, the total thickness (e.g., height)of the semiconductor package including the bottom chip with the recessand the top chip which is placed within the recess is calibrated todesign specifications which permit optimal thermal distribution whilealso mechanically preventing warpage due to the retained non-etchedportions of the bottom chip. For instance, the bottom chip may be etchedto form a recess which retains sufficiently thick portions to permitoptimal heat spreading without permitting the bottom chip to warp orcurl as it transitions through varying thermal profiles either inmanufacturing or in operation.

According to certain embodiments a wet etch is utilized which avoids thesharp interior angles within the recess. For instance, a wet etch may beutilized to create a recess having inner corners which are sloped orcurved and therefore less susceptible to fracture due to the brittlenature of the functional silicon chip being etched.

In other embodiments Reactive Ion Etching (RIE) is utilized to form therecess which results in more squared inner corners and thus permits atighter bond between the bottom chip and the top chip once placed andaffixed to the bottom chip via glue or die attached film.

FIG. 5B depicts a continuation process flow 502 for the non-planarstacking of a top chip to a bottom chip 525 with connectivity to asubstrate 535.

As depicted here, a pick and place operation 583 places the top chip 530into the formed recess (e.g., element 550 from FIG. 5A) of the bottomchip 525. Although the top chip is depicted as right edge aligned withthe bottom chip, it is not necessary to be aligned. Rather, the top chipmay overhang the bottom, be aligned to the bottom, be centered with thebottom, or inset from a left or right edge of the bottom. According to aparticular embodiment, the top chip 530 is attached to the bottom chip525 with die attached film.

As can be seen, the top chip 530 is placed within the recess of thebottom chip 525 such that at least part of the height of the top chip iswithin the vertical height of the bottom chip, thus providing areduction in height on the vertical axis.

Processing may then deviate to any one of the alternative processes 551as set forth at alternative processing (a) at element 555, alternativeprocessing (b) at element 560, or alternative processing (c) at element565, each provided via the figures that follow.

FIG. 5C depicts a continuation process flow 503 for alternativeprocessing (a) at element 555 from FIG. 5B.

As depicted here at alternative processing (a) at element 555, a wirebond process 561 may be utilized to wire bond the top chip 530 havingbeen pick and placed upon and into the recess formed within the bottomchip 525, thus creating a wire bond 520 from the contacts of the topchip 530 to the TSVs 540 formed within the bottom chip. Electricalconnectivity is thus provided from contacts of the top chip 530 to theTSVs 540 via the wire bonds 520 and to the micro-bumps 515 which wouldthen connect with or which would already be connected with asemiconductor package substrate (not shown here).

At over mold operation 562 the semiconductor package is then overmolded,thus fully encompassing and protecting the top chip 530 which is nowwithin the recess of the bottom chip 525 and its electrical wire bond520 connections to the TSVs 540 which lead then to the micro-bumps 515to the substrate 535 to the solder balls 510.

FIG. 5D depicts a continuation process flow 504 for alternativeprocessing (b) at element 560 from FIG. 5B.

As depicted here at alternative processing (b) at element 560, operation563 deposits the metal forming the non-planar RDL 576 on top of thealready placed top chip 530 now residing within the recess of the bottomchip 525, thus providing connectivity from the contacts of the top chip530 through the non-planar RDL 576 to the TSVs 540 through the bottomchip 525 and to the micro-bumps 515. According to such embodiments, anyside gap between top and bottom dies due to varying tolerances may befilled prior to RDL layer buildup.

Notably, the top chip resides only partially within the recess of thebottom chip and therefore protrudes at a top surface from the bottomchip necessitating that there be a non-planar RDL 576 layer toaccommodate the now non-planar surface formed from the top chip placedwithin the bottom chip.

At over mold operation 564 the semiconductor package is then overmolded,thus fully encompassing and protecting the top chip 530 which is nowwithin the recess of the bottom chip 525 and its electrical non-planarRDL 576 connectivity with the TSVs 540 which lead then to themicro-bumps 515 to the substrate 535 to the solder balls 510.

FIG. 5E depicts a continuation process flow 506 for alternativeprocessing (c) at element 565 from FIG. 5B.

As depicted here at alternative processing (c) at element 565, operation566 deposits the metal forming the planar RDL layer 575 on top of thealready placed top chip 530 now residing fully within the recess of thebottom chip 525, thus providing connectivity from the contacts of thetop chip 530 through the planar RDL 575 to the TSVs 540 through thebottom chip 525 and to the micro-bumps 515.

Notably, the entire height of the top chip is fully within the height ofthe bottom chip, permitting the bottom chip to fully encompass the topchip within its recess. Consequently, a planar RDL 575 may be formedrather than the non-planar RDL 576 depicted in the prior alternativeprocessing (b) at element 560 of FIG. 5D.

At over mold operation 567 of FIG. 5E, the semiconductor package is thenovermolded, thus fully encompassing and protecting the top chip 530which is now within the recess of the bottom chip 525 and its electricalplanar RDL 575 connectivity with the TSVs 540 which lead then to themicro-bumps 515 to the substrate 535 to the solder balls 510.

FIG. 6A depicts an alternative process flow 601 for the non-planarstacking of an overlapping top chip 630 onto a bottom chip 625.

As can be seen, there is first a top chip 630 which is placedup-side-down such that the bottom surface of the top chip 630 may becovered with a photo resist layer 645. Operation 661 then exposes thephoto resist layer.

At operation 662 there is a wet etch process to etch away a recess intothe bottom surface of the still up-side-down top chip 630.

At operation 663, the top chip 630 is now inverted by flipping the topchip 630 over such that the recess formed into the bottom surface of thetop chip is now facing downward.

At operation 664 a pick and place operation places the top chip 630 ontoa bottom chip forming a non-planar and overlapping stacked semiconductorpackage in which the top chip 630 full overlaps laterally in thehorizontal axis the bottom chip 625, with the bottom chip 625 having itsheight at least partially encompassed within the height of the top chip630 via the recess formed into the top chip 630.

In such a way, the overlapping top die or top chip 630 is thinned in themiddle while the edge of the overlapping top chip 630 remain such thatthey (e.g., the edges) provide for greater die structural stabilization.

FIG. 6B depicts a continuation process flow 602 for a non-planar andoverlapping top chip 630.

In particular, it can now be seen via the semiconductor package isunderfilled 666 such that the assembled top chip 630 having the wetetched recess is overlapping the bottom chip 625 thus providing thereduced height 691 (in the Z or vertical axis) and additionally isprotected by the underfill material 667. The x, y, and z axises 690 aredepicted at the bottom left.

Additionally depicted is the top chip wire bonded 620 to the substrate635 to provide electrical connectivity. Contacts of the bottom chip 625are shown connected with the substrate 635 through the micro-bumps 615.

At the bottom of the figure the semiconductor package is now depicted asbeing connected to a PCB board 605 via solder balls 610 whichelectrically interface to the substrate 635.

FIG. 7 is a schematic of a computer system 700 in accordance withdescribed embodiments. The computer system 700 (also referred to as theelectronic system 700) as depicted can embody means for implementingreduced height semiconductor packages for mobile electronics, accordingto any of the several disclosed embodiments and their equivalents as setforth in this disclosure. The computer system 700 may be a mobile devicesuch as a netbook computer. The computer system 700 may be a mobiledevice such as a wireless smart phone or tablet. The computer system 700may be a desktop computer. The computer system 700 may be a hand-heldreader. The computer system 700 may be a server system. The computersystem 700 may be a supercomputer or high-performance computing system.

In accordance with one embodiment, the electronic system 700 is acomputer system that includes a system bus 720 to electrically couplethe various components of the electronic system 700. The system bus 720is a single bus or any combination of busses according to variousembodiments. The electronic system 700 includes a voltage source 730that provides power to the integrated circuit 710. In some embodiments,the voltage source 730 supplies current to the integrated circuit 710through the system bus 720.

Such an integrated circuit 710 is electrically coupled to the system bus720 and includes any circuit, or combination of circuits according to anembodiment. In an embodiment, the integrated circuit 710 includes aprocessor 712 that can be of any type. As used herein, the processor 712may mean any type of circuit such as, but not limited to, amicroprocessor, a microcontroller, a graphics processor, a digitalsignal processor, or another processor. In an embodiment, the processor712 includes, or is coupled with, electrical devices having gradientencapsulant protection, as disclosed herein.

In accordance with one embodiment, SRAM embodiments are found in memorycaches of the processor. Other types of circuits that can be included inthe integrated circuit 710 are a custom circuit or anapplication-specific integrated circuit (ASIC), such as a communicationscircuit 714 for use in wireless devices such as cellular telephones,smart phones, pagers, portable computers, two-way radios, and similarelectronic systems, or a communications circuit for servers. In anembodiment, the integrated circuit 710 includes on-die memory 716 suchas static random-access memory (SRAM). In an embodiment, the integratedcircuit 710 includes embedded on-die memory 716 such as embedded dynamicrandom-access memory (eDRAM).

In accordance with one embodiment, the integrated circuit 710 iscomplemented with a subsequent integrated circuit 711. Usefulembodiments include a dual processor 713 and a dual communicationscircuit 715 and dual on-die memory 717 such as SRAM. In accordance withone embodiment, the dual integrated circuit 710 includes embedded on-diememory 716 such as eDRAM.

In one embodiment, the electronic system 700 also includes an externalmemory 740 that in turn may include one or more memory elements suitableto the particular application, such as a main memory 742 in the form ofRAM, one or more hard drives 744, and/or one or more drives that handleremovable media 746, such as diskettes, compact disks (CDs), digitalvariable disks (DVDs), flash memory drives, and other removable mediaknown in the art. The external memory 740 may also be embedded memory748 such as the first die in a die stack, according to an embodiment.

In accordance with one embodiment, the electronic system 700 alsoincludes a display device 750 and an audio output 760. In oneembodiment, the electronic system 700 includes an input device 770 suchas a controller that may be a keyboard, mouse, trackball, gamecontroller, microphone, voice-recognition device, or any other inputdevice that inputs information into the electronic system 700. In anembodiment, an input device 770 is a camera. In an embodiment, an inputdevice 770 is a digital sound recorder. In an embodiment, an inputdevice 770 is a camera and a digital sound recorder.

As shown herein, the integrated circuit 710 can be implemented in anumber of different embodiments, including a package substrate or asemiconductor package having therein means for implementing reducedheight semiconductor packages for mobile electronics, according to anyof the several disclosed embodiments and their equivalents, anelectronic system, a computer system, one or more methods of fabricatingan integrated circuit, and one or more methods of fabricating anelectronic assembly that includes a package substrate or a semiconductorpackage having therein means for implementing reduced heightsemiconductor packages for mobile electronics, according to any of theseveral disclosed embodiments as set forth herein in the variousembodiments and their art-recognized equivalents. The elements,materials, geometries, dimensions, and sequence of operations can all bevaried to suit particular I/O coupling requirements including arraycontact count, array contact configuration for a microelectronic dieembedded in a processor mounting substrate according to any of theseveral disclosed package substrates and semiconductor packages havingmeans for implementing reduced height semiconductor packages for mobileelectronics embodiments and their equivalents. A foundation substrate798 may be included, as represented by the dashed line of FIG. 7.Passive devices 799 may also be included, as is also depicted in FIG. 7.

FIG. 8 illustrates an interposer 800 that includes one or more describedembodiments. The interposer 800 is an intervening substrate used tobridge a first substrate 802 to a second substrate 804. The firstsubstrate 802 may be, for instance, an integrated circuit die. Thesecond substrate 804 may be, for instance, a memory module, a computermotherboard, or another integrated circuit die. Generally, the purposeof an interposer 800 is to spread a connection to a wider pitch or toreroute a connection to a different connection. For example, aninterposer 800 may couple an integrated circuit die to a ball grid array(BGA) 806 that can subsequently be coupled to the second substrate 804.In some embodiments, the first and second substrates 802/804 areattached to opposing sides of the interposer 800. In other embodiments,the first and second substrates 802/804 are attached to the same side ofthe interposer 800. And in further embodiments, three or more substratesare interconnected by way of the interposer 800.

The interposer 800 may be formed of an epoxy resin, afiberglass-reinforced epoxy resin, a ceramic material, or a polymermaterial such as polyimide. In further implementations, the interposermay be formed of alternate rigid or flexible materials that may includethe same materials described above for use in a semiconductor substrate,such as silicon, germanium, and other group III-V and group IVmaterials.

The interposer may include metal interconnects 808 and vias 810,including but not limited to through-silicon vias (TSVs) 812. Theinterposer 800 may further include embedded devices 814, including bothpassive and active devices. Such devices include, but are not limitedto, capacitors, decoupling capacitors, resistors, inductors, fuses,diodes, transformers, sensors, and electrostatic discharge (ESD)devices. More complex devices such as radio-frequency (RF) devices,power amplifiers, power management devices, antennas, arrays, sensors,and MEMS devices may also be formed on the interposer 800. In accordancewith described embodiments, apparatuses or processes disclosed hereinmay be used in the fabrication of interposer 800.

FIG. 9 illustrates a computing device 900 in accordance with oneimplementation of the invention. The computing device 900 houses a board902. The board 902 may include a number of components, including but notlimited to a processor 904 and at least one communication chip 906. Theprocessor 904 is physically and electrically coupled to the board 902.In some implementations the at least one communication chip 906 is alsophysically and electrically coupled to the board 902. In furtherimplementations, the communication chip 906 is part of the processor904.

Depending on its applications, computing device 900 may include othercomponents that may or may not be physically and electrically coupled tothe board 902. These other components include, but are not limited to,volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), flashmemory, a graphics processor, a digital signal processor, a cryptoprocessor, a chipset, an antenna, a display, a touchscreen display, atouchscreen controller, a battery, an audio codec, a video codec, apower amplifier, a global positioning system (GPS) device, a compass, anaccelerometer, a gyroscope, a speaker, a camera, and a mass storagedevice (such as hard disk drive, compact disk (CD), digital versatiledisk (DVD), and so forth).

The communication chip 906 enables wireless communications for thetransfer of data to and from the computing device 900. The term“wireless” and its derivatives may be used to describe circuits,devices, systems, methods, techniques, communications channels, etc.,that may communicate data through the use of modulated electromagneticradiation through a non-solid medium. The term does not imply that theassociated devices do not contain any wires, although in someembodiments they might not. The communication chip 906 may implement anyof a number of wireless standards or protocols, including but notlimited to Wi-Fi (IEEE 802.11 family), WiMAX (IEEE 802.16 family), IEEE802.20, long term evolution (LTE), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE,GSM, GPRS, CDMA, TDMA, DECT, Bluetooth, derivatives thereof, as well asany other wireless protocols that are designated as 3G, 4G, 5G, andbeyond. The computing device 900 may include a plurality ofcommunication chips 906. For instance, a first communication chip 906may be dedicated to shorter range wireless communications such as Wi-Fiand Bluetooth and a second communication chip 906 may be dedicated tolonger range wireless communications such as GPS, EDGE, GPRS, CDMA,WiMAX, LTE, Ev-DO, and others.

The processor 904 of the computing device 900 includes an integratedcircuit die packaged within the processor 904. In some implementationsof the invention, the integrated circuit die of the processor includesone or more devices, such as MOS-FET transistors built in accordancewith implementations of the invention. The term “processor” may refer toany device or portion of a device that processes electronic data fromregisters and/or memory to transform that electronic data into otherelectronic data that may be stored in registers and/or memory.

The communication chip 906 also includes an integrated circuit diepackaged within the communication chip 906. In accordance with anotherimplementation of the invention, the integrated circuit die of thecommunication chip includes one or more devices, such as MOS-FETtransistors built in accordance with implementations of the invention.

In further implementations, another component housed within thecomputing device 900 may contain an integrated circuit die that includesone or more devices, such as MOS-FET transistors built in accordancewith implementations of the invention.

In various implementations, the computing device 900 may be a laptop, anetbook, a notebook, an ultrabook, a smartphone, a tablet, a personaldigital assistant (PDA), an ultra mobile PC, a mobile phone, a desktopcomputer, a server, a printer, a scanner, a monitor, a set-top box, anentertainment control unit, a digital camera, a portable music player,or a digital video recorder. In further implementations, the computingdevice 900 may be any other electronic device that processes data.

FIG. 10 is a flow diagram illustrating a method 1000 for implementingreduced height semiconductor packages for mobile electronics inaccordance with described embodiments. Some of the blocks and/oroperations listed below are optional in accordance with certainembodiments. The numbering of the blocks presented is for the sake ofclarity and is not intended to prescribe an order of operations in whichthe various blocks must occur. Additionally, operations from flow 1000may be utilized in a variety of combinations.

At block 1005 the method 1000 for manufacturing a stacked die packagebegins.

At block 1010 the method includes fabricating a bottom functionalsilicon die.

At block 1015 the method includes etching a trough into the bottomfunctional silicon die partially reducing a vertical height of thebottom functional silicon die in a localized area at the trough to forma recess within the bottom functional silicon die.

At block 1020 the method includes positioning a top component at leastpartially within the recess formed within the bottom functional silicondie.

At block 1025 the method may optionally include electrically interfacinga substrate to a bottom surface of the bottom functional silicon die.However, it is not necessary to incorporate the substrate into thestacked die package which may be electrically interfaced to anotherboard (e.g., such as a PCB, motherboard, etc.) via alternativeinterfacing means.

While the subject matter disclosed herein has been described by way ofexample and in terms of the specific embodiments, it is to be understoodthat the claimed embodiments are not limited to the explicitlyenumerated embodiments disclosed. To the contrary, the disclosure isintended to cover various modifications and similar arrangements aswould be apparent to those skilled in the art. Therefore, the scope ofthe appended claims should be accorded the broadest interpretation so asto encompass all such modifications and similar arrangements. It is tobe understood that the above description is intended to be illustrative,and not restrictive. Many other embodiments will be apparent to those ofskill in the art upon reading and understanding the above description.The scope of the disclosed subject matter is therefore to be determinedin reference to the appended claims, along with the full scope ofequivalents to which such claims are entitled.

It is therefore in accordance with the described embodiments, that:

According to one embodiment there is a stacked die package havingtherein: a bottom functional silicon die; a recess formed within thebottom functional silicon die by a thinning etch partially reducing avertical height of the bottom functional silicon die at the recess; atop component positioned at least partially within the recess formedwithin the bottom functional silicon die; and a substrate electricallyinterfaced with the bottom functional silicon die.

In accordance with another embodiment of the stacked die package, thetop component positioned at least partially within the recess formedwithin the bottom functional silicon die includes a top functionalsilicon die positioned at least partially within the recess of thebottom functional silicon die.

In accordance with another embodiment of the stacked die package, thetop component positioned at least partially within the recess formedwithin the bottom functional silicon die includes a heat spreader toextract heat away from a logic device integrated within the bottomfunctional silicon die.

In accordance with another embodiment of the stacked die package, thetop component positioned at least partially within the recess formedwithin the bottom functional silicon die includes one of: a passivedevice; a memory chip, a second functional silicon die, a System on aChip (SoC) device, a sensor unit, a receiver, a transmitter, or atransceiver.

In accordance with another embodiment of the stacked die package, therecess formed within the bottom functional silicon die is formed by achemical wet etch process to open a trough within the bottom functionalsilicon die, in which the trough forms the recess within which the topcomponent is positioned.

In accordance with another embodiment of the stacked die package, therecess formed within the bottom functional silicon die is formed by aReactive Ion Etching (RIE) process to open the recess within the bottomfunctional silicon die within which the top component is positioned.

In accordance with another embodiment of the stacked die package, thebottom functional silicon die is electrically interfaced to thesubstrate via micro-balls of a Ball Grid Array or via a Flip-Chip BallGrid Array (FCBGA) or via Copper pillar.

In accordance with another embodiment of the stacked die package, thetop component includes a second functional silicon die positioned atleast partially within the recess of the bottom functional silicon die;in which the bottom functional silicon die is electrically interfaced tothe substrate via micro-balls of a Ball Grid Array (BGA) or via aFlip-Chip Ball Grid Array (FCBGA) or via Copper pillar; and in which thesecond functional silicon die is electrically interfaced to thesubstrate via wire bonds from contacts at a top surface of the secondfunctional silicon die over one or more sides of the bottom functionalsilicon die to the substrate.

In accordance with another embodiment of the stacked die package, thetop component includes a second functional silicon die positioned atleast partially within the recess of the bottom functional silicon die;in which the bottom functional silicon die includes a plurality ofThrough Silicon Vias (TSVs), each of the TSVs providing an electricalpathway from a top surface of the bottom functional silicon die to abottom surface of the bottom functional silicon die; in which the secondfunctional silicon die is electrically interfaced to the substrate viawire bonds from contacts at a top surface of the second functionalsilicon die to the plurality of TSVs of the bottom functional silicondie, the TSVs of the bottom functional silicon die providing electricalconnectivity from the top surface of the bottom functional silicon dieto the bottom surface of the bottom functional silicon die; and in whichthe bottom surface of the functional silicon die is electricallyinterfaced to the substrate via micro-balls between the bottom surfaceof the functional silicon die and a top surface of the substrate.

In accordance with another embodiment of the stacked die package, thetop component includes a second functional silicon die positioned atleast partially within the recess of the bottom functional silicon die;in which the bottom functional silicon die includes a plurality ofThrough Silicon Vias (TSVs), each of the TSVs providing an electricalpathway from a top surface of the bottom functional silicon die to abottom surface of the bottom functional silicon die; in which the secondfunctional silicon die is electrically interfaced to the substrate usinga Re-Distribution Layer (RDL) providing electrical connectivity fromcontacts at a top surface of the second functional silicon die to theplurality of TSVs of the bottom functional silicon die, the TSVs of thebottom functional silicon die providing electrical connectivity from thetop surface of the bottom functional silicon die to the bottom surfaceof the bottom functional silicon die; and in which the bottom surface ofthe functional silicon die is electrically interfaced to the substratevia micro-balls between the bottom surface of the functional silicon dieand a top surface of the substrate.

In accordance with another embodiment, the stacked die package furtherincludes: a plurality of micro-balls providing electrical connectivitybetween a bottom surface of the bottom functional semiconductor deviceand a top surface of the substrate of the stacked die package; andsolder balls at a bottom surface of the substrate to provide electricalconnectivity from the substrate of the stacked die package to anothercircuit board, printed circuit board, assembly board, mother board, orsub-assembly board of a consumer electronics device.

In accordance with another embodiment of the stacked die package, thetop component has a height which is fully encompassed within a height ofthe recess formed within the bottom functional silicon device; and inwhich a top surface of the top component is planar with a topnon-recessed surface of the bottom functional silicon device.

In accordance with another embodiment of the stacked die package, thetop component has a height which is greater than a height of the recessformed within the bottom functional silicon device; and in which a topsurface of the top component protrudes beyond a top non-recessed surfaceof the bottom functional silicon device.

It is therefore in accordance with yet another embodiment that there isa method of manufacturing a stacked die package, in which the methodincludes at least: fabricating a bottom functional silicon die; etchinga trough into the bottom functional silicon die partially reducing avertical height of the bottom functional silicon die in a localized areaat the trough to form a recess within the bottom functional silicon die;positioning a top component at least partially within the recess formedwithin the bottom functional silicon die; and electrically interfacing asubstrate to a bottom surface of the bottom functional silicon die.

In accordance with another embodiment of the method, positioning the topcomponent at least partially within the recess formed within the bottomfunctional silicon die includes: positioning the top component via apick and place operation; and affixing the top component positionedwithin the recess of the bottom functional silicon die via a glue or adie attached film.

In accordance with another embodiment of the method, electricallyinterfacing the substrate to the bottom surface of the bottom functionalsilicon die includes: affixing the substrate to the bottom surface ofthe bottom functional silicon die via micro-balls of a Ball Grid Arrayusing a reflow operation.

In accordance with another embodiment of the method, etching the troughinto the bottom functional silicon die includes performing a chemicalwet etch to open the trough within the bottom functional silicon die, inwhich the trough forms the recess within which the top component ispositioned.

In accordance with another embodiment of the method, etching the troughinto the bottom functional silicon die includes performing a ReactiveIon Etching (RIE) process to open the recess within the bottomfunctional silicon die within which the top component is positioned.

In accordance with another embodiment of the method, the top componentincludes a second functional silicon die positioned at least partiallywithin the recess of the bottom functional silicon die; and in which themethod further includes wire bonding contacts at a top surface of thesecond functional silicon die to a top surface of the substrate over oneor more sides of the bottom functional silicon device.

In accordance with another embodiment of the method, the top componentincludes a second functional silicon die positioned at least partiallywithin the recess of the bottom functional silicon die; and in which themethod further includes: opening a plurality of Through Silicon Vias(TSVs) vertically through the bottom functional silicon die, each of theTSVs providing an electrical pathway from a top surface of the bottomfunctional silicon die to a bottom surface of the bottom functionalsilicon die; and electrically interfacing contacts at a top surface ofthe second functional silicon die to the plurality of TSVs of the bottomfunctional silicon die, the TSVs of the bottom functional silicon dieproviding electrical connectivity from the top surface of the bottomfunctional silicon die to the bottom surface of the bottom functionalsilicon die; and in which the bottom surface of the functional silicondie is electrically interfaced to the substrate via micro-balls betweenthe bottom surface of the functional silicon die and a top surface ofthe substrate.

In accordance with another embodiment of the method, top componentincludes a second functional silicon die positioned at least partiallywithin the recess of the bottom functional silicon die; and in which themethod further includes: opening a plurality of Through Silicon Vias(TSVs) vertically through the bottom functional silicon die, each of theTSVs providing an electrical pathway from a top surface of the bottomfunctional silicon die to a bottom surface of the bottom functionalsilicon die; and depositing metal at a top surface of the secondfunctional silicon die forming a Re-Distribution Layer (RDL) providingelectrical connectivity from contacts at a top surface of the secondfunctional silicon die to the plurality of TSVs of the bottom functionalsilicon die, the TSVs of the bottom functional silicon die providingelectrical connectivity from the top surface of the bottom functionalsilicon die to the bottom surface of the bottom functional silicon die;and in which the bottom surface of the functional silicon die iselectrically interfaced to the substrate via micro-balls between thebottom surface of the functional silicon die and a top surface of thesubstrate.

It is therefore in accordance with yet another embodiment that there isan electronics module, the electronics module including: a printedcircuit board; a stacked die package; a plurality of solder ballselectrically interfacing the stacked die package with the printedcircuit board; and in which the stacked die package includes: (i) abottom functional silicon die; (ii) a recess formed within the bottomfunctional silicon die by a thinning etch partially reducing a verticalheight of the bottom functional silicon die at the recess; (iii) a topcomponent positioned at least partially within the recess formed withinthe bottom functional silicon die; and (iv) a substrate electricallyinterfaced with the bottom functional silicon die.

In accordance with another embodiment of the electronics module, thebottom functional silicon die of the stacked die package is electricallyinterfaced to the substrate of the stacked die package via micro-ballsof a Ball Grid Array or via a Flip-Chip Ball Grid Array (FCBGA) or viaCopper pillar.

In accordance with another embodiment of the electronics module, theelectronics module includes one of: a drone and robot controlelectronics module; a smart phone electronics module; a tabletelectronics module; a gesture control electronics module for a computer;a 3D photography electronics module; a 3D immersive gaming electronicsmodule; a face recognition electronics module to perform facerecognition base security in-lieu of alphanumerical passwords; an imagecapture device electronics module having one or more optical andComplementary metal-oxide-semiconductor (CMOS) components affixed to theprinted circuit board as the top side or bottom side components; a depthsensing camera electronics module to perform any of stereoscopic imagingdepth sensing, coded light depth sensing, or laser time of flight depthsensing.

In accordance with another embodiment of the electronics module, theelectronics module includes is embedded within a wearable technology tobe worn as one of: a clothing item; sports attire; a shoe; fashionelectronics to be worn as a clothing item or an accessory; tech togs tobe worn as a clothing item or an accessory; or fashionable technology tobe worn as a clothing item or an accessory.

What is claimed is:
 1. A stacked die package, comprising: a bottomfunctional silicon die; a recess formed within the bottom functionalsilicon die by a thinning etch partially reducing a vertical height ofthe bottom functional silicon die at the recess; and a top componentpositioned at least partially within the recess formed within the bottomfunctional silicon die.
 2. The stacked die package of claim 1, whereinthe top component positioned at least partially within the recess formedwithin the bottom functional silicon die comprises a top functionalsilicon die positioned at least partially within the recess of thebottom functional silicon die.
 3. The stacked die package of claim 1,wherein the top component positioned at least partially within therecess formed within the bottom functional silicon die comprises a heatspreader to extract heat away from a logic device integrated within thebottom functional silicon die.
 4. The stacked die package of claim 1,wherein the top component positioned at least partially within therecess formed within the bottom functional silicon die comprises one of:a passive device; a memory chip, a second functional silicon die, aSystem on a Chip (SoC) device, a sensor unit, a receiver, a transmitter,or a transceiver.
 5. The stacked die package of claim 1, wherein therecess formed within the bottom functional silicon die is formed by achemical wet etch process to open a trough within the bottom functionalsilicon die, wherein the trough forms the recess within which the topcomponent is positioned.
 6. The stacked die package of claim 1, whereinthe recess formed within the bottom functional silicon die is formed bya Reactive Ion Etching (RIE) process to open the recess within thebottom functional silicon die within which the top component ispositioned.
 7. The stacked die package of claim 1: wherein the stackeddie package further comprises a substrate electrically interfaced withthe bottom functional silicon die; and wherein the bottom functionalsilicon die is electrically interfaced to the substrate via micro-ballsof a Ball Grid Array or via a Flip-Chip Ball Grid Array (FCBGA) or viaCopper pillar.
 8. The stacked die package of claim 1: wherein thestacked die package further comprises a substrate electricallyinterfaced with the bottom functional silicon die; wherein the topcomponent comprises a second functional silicon die positioned at leastpartially within the recess of the bottom functional silicon die;wherein the bottom functional silicon die is electrically interfaced tothe substrate via micro-balls of a Ball Grid Array (BGA) or via aFlip-Chip Ball Grid Array (FCBGA) or via Copper pillar; and wherein thesecond functional silicon die is electrically interfaced to thesubstrate via wire bonds from contacts at a top surface of the secondfunctional silicon die over one or more sides of the bottom functionalsilicon die to the substrate.
 9. The stacked die package of claim 1:wherein the stacked die package further comprises a substrateelectrically interfaced with the bottom functional silicon die; whereinthe top component comprises a second functional silicon die positionedat least partially within the recess of the bottom functional silicondie; wherein the bottom functional silicon die comprises a plurality ofThrough Silicon Vias (TSVs), each of the TSVs providing an electricalpathway from a top surface of the bottom functional silicon die to abottom surface of the bottom functional silicon die; wherein the secondfunctional silicon die is electrically interfaced to the substrate viawire bonds from contacts at a top surface of the second functionalsilicon die to the plurality of TSVs of the bottom functional silicondie, the TSVs of the bottom functional silicon die providing electricalconnectivity from the top surface of the bottom functional silicon dieto the bottom surface of the bottom functional silicon die; and whereinthe bottom surface of the functional silicon die is electricallyinterfaced to the substrate via micro-balls between the bottom surfaceof the functional silicon die and a top surface of the substrate. 10.The stacked die package of claim 1: wherein the stacked die packagefurther comprises a substrate electrically interfaced with the bottomfunctional silicon die; wherein the top component comprises a secondfunctional silicon die positioned at least partially within the recessof the bottom functional silicon die; wherein the bottom functionalsilicon die comprises a plurality of Through Silicon Vias (TSVs), eachof the TSVs providing an electrical pathway from a top surface of thebottom functional silicon die to a bottom surface of the bottomfunctional silicon die; wherein the second functional silicon die iselectrically interfaced to the substrate using a Re-Distribution Layer(RDL) providing electrical connectivity from contacts at a top surfaceof the second functional silicon die to the plurality of TSVs of thebottom functional silicon die, the TSVs of the bottom functional silicondie providing electrical connectivity from the top surface of the bottomfunctional silicon die to the bottom surface of the bottom functionalsilicon die; and wherein the bottom surface of the functional silicondie is electrically interfaced to the substrate via micro-balls betweenthe bottom surface of the functional silicon die and a top surface ofthe substrate.
 11. The stacked die package of claim 1, furthercomprising: wherein the stacked die package further comprises asubstrate electrically interfaced with the bottom functional silicondie; a plurality of micro-balls providing electrical connectivitybetween a bottom surface of the bottom functional semiconductor deviceand a top surface of the substrate of the stacked die package; andsolder balls at a bottom surface of the substrate to provide electricalconnectivity from the substrate of the stacked die package to anothercircuit board, printed circuit board, assembly board, mother board, orsub-assembly board of a consumer electronics device.
 12. The stacked diepackage of claim 1: wherein the top component has a height which isfully encompassed within a height of the recess formed within the bottomfunctional silicon device; and wherein a top surface of the topcomponent is planar with a top non-recessed surface of the bottomfunctional silicon device.
 13. The stacked die package of claim 1:wherein the top component has a height which is greater than a height ofthe recess formed within the bottom functional silicon device; andwherein a top surface of the top component protrudes beyond a topnon-recessed surface of the bottom functional silicon device.
 14. Amethod of manufacturing a stacked die package, comprising: fabricating abottom functional silicon die; etching a trough into the bottomfunctional silicon die partially reducing a vertical height of thebottom functional silicon die in a localized area at the trough to forma recess within the bottom functional silicon die; and positioning a topcomponent at least partially within the recess formed within the bottomfunctional silicon die.
 15. The method of claim 14, wherein positioningthe top component at least partially within the recess formed within thebottom functional silicon die comprises: positioning the top componentvia a pick and place operation; and affixing the top componentpositioned within the recess of the bottom functional silicon die via aglue or a die attached film.
 16. The method of claim 14, whereinelectrically interfacing the substrate to the bottom surface of thebottom functional silicon die comprises: wherein the stacked die packagefurther comprises a substrate electrically interfaced with the bottomfunctional silicon die; wherein the method further comprises affixingthe substrate to the bottom surface of the bottom functional silicon dievia micro-balls of a Ball Grid Array using a reflow operation.
 17. Themethod of claim 14, wherein etching the trough into the bottomfunctional silicon die comprises performing a chemical wet etch to openthe trough within the bottom functional silicon die, wherein the troughforms the recess within which the top component is positioned.
 18. Themethod of claim 14, wherein etching the trough into the bottomfunctional silicon die comprises performing a Reactive Ion Etching (RIE)process to open the recess within the bottom functional silicon diewithin which the top component is positioned.
 19. The method of claim14: wherein the stacked die package further comprises a substrateelectrically interfaced with the bottom functional silicon die; whereinthe top component comprises a second functional silicon die positionedat least partially within the recess of the bottom functional silicondie; and wherein the method further comprises wire bonding contacts at atop surface of the second functional silicon die to a top surface of thesubstrate over one or more sides of the bottom functional silicondevice.
 20. The method of claim 14: wherein the stacked die packagefurther comprises a substrate electrically interfaced with the bottomfunctional silicon die; wherein the top component comprises a secondfunctional silicon die positioned at least partially within the recessof the bottom functional silicon die; and wherein the method furthercomprises: opening a plurality of Through Silicon Vias (TSVs) verticallythrough the bottom functional silicon die, each of the TSVs providing anelectrical pathway from a top surface of the bottom functional silicondie to a bottom surface of the bottom functional silicon die; andelectrically interfacing contacts at a top surface of the secondfunctional silicon die to the plurality of TSVs of the bottom functionalsilicon die, the TSVs of the bottom functional silicon die providingelectrical connectivity from the top surface of the bottom functionalsilicon die to the bottom surface of the bottom functional silicon die;and wherein the bottom surface of the functional silicon die iselectrically interfaced to the substrate via micro-balls between thebottom surface of the functional silicon die and a top surface of thesubstrate.
 21. The method of claim 14: wherein the stacked die packagefurther comprises a substrate electrically interfaced with the bottomfunctional silicon die; wherein the top component comprises a secondfunctional silicon die positioned at least partially within the recessof the bottom functional silicon die; and wherein the method furthercomprises: opening a plurality of Through Silicon Vias (TSVs) verticallythrough the bottom functional silicon die, each of the TSVs providing anelectrical pathway from a top surface of the bottom functional silicondie to a bottom surface of the bottom functional silicon die; anddepositing metal at a top surface of the second functional silicon dieforming a Re-Distribution Layer (RDL) providing electrical connectivityfrom contacts at a top surface of the second functional silicon die tothe plurality of TSVs of the bottom functional silicon die, the TSVs ofthe bottom functional silicon die providing electrical connectivity fromthe top surface of the bottom functional silicon die to the bottomsurface of the bottom functional silicon die; and wherein the bottomsurface of the functional silicon die is electrically interfaced to thesubstrate via micro-balls between the bottom surface of the functionalsilicon die and a top surface of the substrate.
 22. An electronicsmodule comprising: a printed circuit board; a stacked die package; aplurality of solder balls electrically interfacing the stacked diepackage with the printed circuit board; and wherein the stacked diepackage comprises: (i) a bottom functional silicon die; (ii) a recessformed within the bottom functional silicon die by a thinning etchpartially reducing a vertical height of the bottom functional silicondie at the recess; and (iii) a top component positioned at leastpartially within the recess formed within the bottom functional silicondie.
 23. The electronics module of claim 22: wherein the stacked diepackage further comprises a substrate electrically interfaced with thebottom functional silicon die; and wherein the bottom functional silicondie of the stacked die package is electrically interfaced to thesubstrate of the stacked die package via micro-balls of a Ball GridArray or via a Flip-Chip Ball Grid Array (FCBGA) or via Copper pillar.24. The electronics module of claim 22, wherein the electronics modulecomprises one of: a drone and robot control electronics module; a smartphone electronics module; a tablet electronics module; a gesture controlelectronics module for a computer; a 3D photography electronics module;a 3D immersive gaming electronics module; a face recognition electronicsmodule to perform face recognition base security in-lieu ofalphanumerical passwords; an image capture device electronics modulehaving one or more optical and Complementary metal-oxide-semiconductor(CMOS) components affixed to the printed circuit board as the top sideor bottom side components; a depth sensing camera electronics module toperform any of stereoscopic imaging depth sensing, coded light depthsensing, or laser time of flight depth sensing.
 25. The electronicsmodule of claim 22, wherein the electronics module comprises is embeddedwithin a wearable technology to be worn as one of: a clothing item;sports attire; a shoe; fashion electronics to be worn as a clothing itemor an accessory; tech togs to be worn as a clothing item or anaccessory; or fashionable technology to be worn as a clothing item or anaccessory